wire bonding的例句大全

Wire bonding is still the most popular interconnect technology in the first-level packaging.

一级封装中最流行的互连技术仍为丝焊.

Ultrasonic wire bonding is one of the most important technologies in chip interconnection of integrated circuits.

超声键合是实现集成电路封装中芯片互连的关键技术之一.

Set up an ultrasonic wire bonding laboratory.

成立超声波电子焊接实验室.

Set up ultrasonic wire bonding laboratory.

成立超声波电子焊接实验室。

In this circumstances, we work with K & S company to develop the computerized wire bonding system.

在这种情况下我们公司和K & S公司合作开发了计算机辅助焊线系统.

Study on the Technology of High Density Gold wire Ball Bonding under Normal Temperature

高密度常温金丝球焊接技术探讨

Study on a New Al-1% Si Bonding Wire for Encapsulation of Integrate Circuit

集成电路封装用新型Al-1%Si键合线的研制

Its comprehensive coverage focuses on printed circuits, integrated circuits, contact materials, semiconductors, wire, bonding, brazing, soldering, and welding.

它的广泛报导集中在原型、激光处理、电铸层、沉淀、粉末冶金、石印术和表面精加工。

A novel gas sensor based on micro-machined ceramic hotplate and a wire-free bonding is presented, which is aim at the shortcomings of high power consumption and difficult to package existing in the current commercial ceramic gas sensors.

针对目前商用陶瓷气体传感器功耗大、封装难的缺点，提出一种陶瓷微加工微热板式气体传感器的结构和无内引线封装的方式。

The first step is to model the close loop control system of wire bonding force.

两步走的策略被采用：第一步，建立键合力控制系统的闭环模型；

The Optimization Design of Wire Bonding Force Control System

引线键合力控制系统的优化设计

The automatic position alignment system for the ultrasonic wire bonding machine

超声压焊机自动位置对准系统

Design of welding pressure control system for ultrasonic gold wire bonding machine

超声波金丝球焊线机焊接压力控制系统设计

Development of Control System Used in Ultrasonic Al Wire Bonding Machine

超声波铝线自动邦定机控制系统的研制

Contrast Research on the Reliability of Gold and Copper Wire/ Ball Bonding

金、铜丝球键合焊点的可靠性对比研究

Fracture Analysis of Ball Bonding Gold Wire and the Way to Improve Processing Function

球焊金丝产生断裂的原因及改善加工性能的途径

Effect of bonding time on thick aluminum wire wedge bonding strength

键合时间对粗铝丝超声引线键合强度的影响

Development of these work is of benefit to raising quality of gold wire ball bonding.

这些工作的开展有利于提高金丝球焊的焊接质量。

Discussion of quality control of gold wire ball bonding

金丝球焊质量控制的探讨

The influences of ultrasonic power on heavy aluminum wire wedge bonding strength were investigated.

超声功率是影响粗铝丝引线键合强度的最主要因素之一。